Nikon Corporation recently introduced their most recent dry scanners the NSR-S310F ArF scanner for quantity production. It is supported by the system which is made on the Tandem Stage platform (TSP), which was specifically made for Nikon’s ArF immersion scanners and thus provides high efficiency and improved configuration accurateness. This is one of the most sophisticated ArF scanners for high quantity production of 65 nm or smaller devices. Nikon’s Tandem Stage technique uses a contact stage and different calibration phase for more throughput (174 wafers or more per hour) and high stability due to regular calibration. It also helps to progress arrangement accuracy to better than 7 nm. Now this is where point lies, having all scanner technologies on the same platform facilitate manufacturing effectiveness at the same time reduces expenditure over time, standardizes software across platforms, and also makes convenient field support. In addition to all this, Tandem Stage platform plan will also decrease tool fixing time. It is expected that the NSR-S310F scanner would be available to the users from the fourth quarter of 2007 although there is no word about the pricing of the product till now.