Following the NSR-S610C platform, Nikon Corporation will soon offer a new immersion scanner for Double Patterning to their customers. Expected to be released by the 4th quarter of 2008, this new device will focus on critical overlay requirements of Double Patterning. Nikon plans to enhance the performance of NSR-S610C ArF immersion scanner by integrating Tandem Stage platform and Nikon proprietary Local Fill Technology.

Currently immersion lithography is widely used to satisfy ever-shrinking device requirements at 45 nm volume. However, Double Patterning is seen as the leading technology solution for the 32 nm node. The 32 nm volume production must begin between 2011 and 2013. Thus, using S610C platform in late 2008 or early 2009 is a low risk solution for customers to begin their Double Patterning projects.