It doesn’t get any smaller than this! OmniVision, a leading developer of advanced digital imaging solutions, introduced a simplified new approach to mobile phone designs with its latest innovation in a series of industry firsts.

OmniVision’s new CameraCube(TM) technology is a three-dimensional reflowable, total camera solution that combines the full functionality of a single-chip image sensor, embedded image processor, and wafer-level optics in one compact, small-footprint package.

OmniVision’s unique approach has enabled the industry’s smallest profile and z-height (down to 2.5 X 2.9 X 2.5 mm), making it an ideal solution for today’s ultra-slim mobile phones.

“Today’s announcement represents the culmination of years of strategic planning,” said James He, OmniVision Chief Operating Officer. “We carefully identified the elements needed to develop a small footprint, total camera solution. We made a strategic investment in the supply chain with VisEra Technologies, brought the expertise required in-house through our acquisition of OmniVision CDM Optics, and collaborated with the industry’s leading wafer-level lens suppliers.”

(Source) Press

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