Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies has created yet another breakthrough design in Bridge Chips. Introducing the availability of three new bridge chips for use in mobile phones, a Mobile Industry Processor Interface (MIPI®) camera serial interface (CSI), to a Mobile Display Digital Interface (MDDI) chip and two MDDI-MIPI display serial interface (DSI) chips.

These products provide high-speed serial interfaces between a mobile phone’s baseband or application processor and the phone’s display or integrated camera and are a requirement for high-resolution displays and cameras used in smartphones, mobile internet devices, netbooks, smartbooks and other high-performance mobile devices.

Deepak Prakash, director, Digital Multimedia Business Development, ASSP Business Unit at TAEC, said, “With their support of high-speed MIPI and MDDI interfaces, our new bridge chips will allow customers to design mobile devices that can easily handle high-bandwidth communication between the phone’s display, camera and baseband or application processor, giving consumers an uncompromised video experience.”
Engineering samples are available in March and April. Mass production is due to start in the 3rd and 4th quarter 2010. The price of tha parts is $1.50 per unit in 10,000 unit quantities.

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